Surface Chemistry
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Wafer cleaning simply means removal of particles and contamination
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Purpose of wafer cleaning is remove the particles and impurities on the silicon substrates without damage
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Particle contaminants and impurities affect device performance, product yield and reliability, therefore it is important to clean substrate surface
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Representatively, there are two methods for wafer cleaning process such as wet clearing and dry cleaning
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Wet cleaning is normally used for wafer cleaning due to excellent particle removal efficiency for organic and inorganic contaminants
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However, there is environment issues on wet cleaning of silicon surfaces
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Therefore, eco-friendly wafer cleaning technology is required in the current industry
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Recently, eco-friendly and cost-effective cleaning technology is required for ecological reasons.
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Our laboratory researches eco-friendly wafer cleaning technology for removing small particles without damage.
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A method based on a polymer coating.